Used in the semiconductor industry for yield enhancement during R&D, Technology Ramping and Mass Production phases. Provides non-destructive quantitative elemental measurements in the first few nanometers below the surface on product wafers (scribe lines or small test pads). Applications Include fast quantitation and uniformity measurement of ultra- low energy implants, B, Ge and C in SiGe, nitrogen-oxygen in ultra-thin oxynitride, and high-k dielectric (Hf and Zr oxides).

CAMECA’s Sahllow Probe LEXFAB-300 provide full-wafer (200 and 300 mm)analysis, is fully compatible with SEMI standards and incorporates SECS / GEM automation.