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Semiconductor Metrology
Defect Inspection, Review and ADC
Contact & Support
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Vistec SpotCheck
Overview
SpotCheck is a software for
automatic site inspection on semiconductor
wafers. It can be used for reticle
inspection, fuse inspection,
bondpad inspection and for
overlay check. Freely programmable spots
(areas) are visited on a wafer.
Multiple images are used to
detect nonsystematic deviations and
irregularities. A "golden image" is applied
to recognize systematic defects. Both
methods are combinable. The user just tells
the system which dies are to be inspected,
presses the start button and within a
minimum of time a multi format result file
is fully automatically created and can be
handed over to any conventional Data
Management System.
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Key Features
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High Throughput with operator
independent results for your defect management
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Replaces expensive overlay
metrology tools for non critical layers
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Minimum time for recipe
setup-simple operation based upon automated
parameter setup
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Allows fast and reliable reticle
check
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Minimum cost of ownership - in
comparison with operator based solutions
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Easy operation - requires less
engineering time
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Platform independent -
retrofittable to existing INS3000, INS3300 and
LDS 3000 systems
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Fully integrated in Viscon NT -
only minimum additional training required
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Combinable with ADC - fully
automated detection and classification
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Detailed Description
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SpotCheck
software is an optimum upgrade for all Vistec
200 mm inspection stations as well as a must for
each newly installed 300 mm and macro inspection
stations. Besides a very high throughput the
SpotCheck software provides extremely easy
operation with highly accurate and repeatable
detection results and minimum cost of ownership.
As it is fully integrated into the Viscon NT
software, the user needs hardly any additional
training. The typical time for a recipe setup is
below 5 minutes.
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With SpotCheck software, both systematic and
nonsystematic defects are detected. Systematic
defects are defects that are present in every
Die/SAW of the wafer and are detected using a
golden image generated from a non-defective
wafer. Examples of systematic defects that can
be detected are a wrong reticle, or an overlay
shift.
Non systematic defects are defects randomly
distributed on a wafer such as particles or
scratches. These defects can be detected using
either a golden image or die-to-die comparison.
Typical defects detectable are residual resists,
extra pattern, particles, micro-masking, probe
mark position errors, etc. In combination with
the field-proven Vistec ADC NT (Automatic Defect
Classification) the review station can classify
defects in-line without any additional wafer
handling.
In a special mode, SpotCheck allows for
automatic and very fast overlay check and is
therefore able to replace expensive dedicated
overlay metrology systems for many layers.
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