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Semiconductor Metrology
Marco and Micro Defect Review Tool
Contact & Support
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Vistec LDS3300
Overview
Peak Performance in Automatic Defect
Detection for 300mm Wafers
The brand new automated defect detection
and classification system Vistec LDS3300 M / LDS3300 C
is the ultimate solution for all 300 mm wafer
applications.
A flexible system layout and the
integrated software capabilities allow for a perfect
integration in the 300 mm fab automation process.
The unique system modularity as well as
the highest throughput in the industry ensures excellent
efficiency in increasing overall fab yield, reducing CoO
and offers a complete integrated solution for all world
leading-edge technology fabrications by being 100%
compatible with the 300mm fab line standards.
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Key Features
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High resolution color CCD camera
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Color image based detection in
brightfield mode
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Simultaneous illumination methods for
embedded and surface defects
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High Throughput , up to 130 Wph
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Reliable & repeatable results through
world class optical imaging
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Partial die analysis for wafer edge
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Macro ADC for Die-level and Wafer-level
defects
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Measurement of EBR- width and offset
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SAW shift algorithm
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Automatic defect review (ADR)
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Automated single site inspection (SpotCheck)
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High resolution <80nm (micro module)
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Waferless recipe creation
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Flexible system layout (front- or rear-
loading)
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Detailed Description
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The Vistec LDS3300 M / LDS3300 C
system is designed for 300mm and 200mm wafers
and incorporates automated defect detection,
classification and inline review.
This product is keeping the advantages of the
field-proven INS3300 inspection and review
system and combines it with a new intelligence
of inspecting the entire surface of a 300mm
wafer for macroscopic defects, using
simultaneous bright and dark field illumination.
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The unique system modularity as
well as the highest throughput in the industry
ensures excellent efficiency in increasing
overall fab yield and reducing CoO.
Vistec's intelligent combination of 100% macro
inspection and the optional inline microscope
module for macro recipe verification, inline
review and micro defect detection at single
sites, offers a complete integrated solution for
all world leading-edge technology fabrications
by being 100% compatible with the 300mm fab line
standards.
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The macro module of the Vistec
LDS3000 M (M= macro) system automatically
captures a full color image of the entire wafer
surface.
This image is compared by either die to die as
well as die to reference information.
Differences are considered as defects and will
be compared to a image library of known
classified defect groups.
Based on this automatic defect classification,
the system individually decides further steps
(Go, NoGo, Inline Microscopic Review, Alarm, . .
.).
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The microscope module of the Vistec LDS3300 C
(C= combination) system has a unique
multi-wavelength design with the opportunity to
include all applicable imaging modes such as
brightfield, darkfield, interference contrast,
UV (ultraviolet, 365nm) and DUV (deep
ultraviolet, 248nm) in the highest automation
degree known in the industry.
This is reached by full automation of all
imaging modes including the full autofocus
capability even in UV and DUV.
The resulting high resolution of 80nm is
equivalent to about 1/1000 of a human hair.
Films, lines and other structures applied to the
wafer can now be imaged with ultimate precision.
The usage of the microscope module incorporates
the usage of a second inspection stage inside
the same tool that operates simultaneously.
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