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Semiconductor Metrology
Marco and Micro Defect Review Tool
Contact & Support
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Vistec LDS3200
Overview
Combining high-speed macro defect detection
with high-resolution optical inspection and review.
The LDS3200 for automated macro defect
inspection and microscopic review provides semiconductor
device manufacturers with complete and accurate process
information. It reduces semiconductor manufacturing
operating costs by increasing the probe yield
learning
rate, reducing time-to-detect and time-to-correct
excursions.
The system’s unique 2 in 1 concept allows
complete automation of process control steps previously
accomplished by human operators. There is no more need for
the time-consuming wafer transport between stand-alone
inspection and review systems.
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Key Features
Macro key features
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Full color inspection for 100% of the wafer
frontside, including test dies, partial dies, scribe lines and
the edge exclusion
zone
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Sensitivity down to 10ěm
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Throughput up to 150 wafers per hour
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Advanced macro illumination mode combines
multiple light sources as well as different illumination angles
for superb detection results
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Wafer radius based sensitivity setting
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Easy setup and programming
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Edge-bead-removal width and shift measurement (EBR)
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Inline Automatic Defect Classification (Macro
ADC)
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Shifted exposure design (SAW-Shift algorithm)
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Combination of wafer-level and die-level
inspection
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Waferless fast recipe creation
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Reliable tool matching procedure
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Field proven graphical user interface “VISCON”
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Detailed Description
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Macro inspection unit
The LDS3200 enables macro defect inspection without limits. A
new generation of macro defect detection tool allows real 100%
automated process control within lithography, CMP, etch and
other applications. Outstanding detection methods using the full
color information cover the complete process variety and focus
on true defects. Typical defects detectable with the LDS3200 are
defocus, hot spot, residue resist or resist bubbles, color
variation caused by different film thickness, deep trench
problems, micro scratches, residue slurry, under- or
over-polishing and handling scratches.
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Micro inspection and review unit
The high-resolution optical microscope allows review of defects
previously detected with the macro inspection unit of the
LDS3200 or any other automatic wafer inspection system. It can
be used to capture high resolution images of any detected defect
by using the Automatic Defect Review (ADR) function. The next
step of automation is Automatic Defect Classification (ADC),
which enables highly accurate classification of the defects
based on the high resolution image. Very beneficial is the
simultaneous use of the unique SpotCheck software in combination
with the macro inspection. This combines the 100% macro
inspection of the wafers with an intelligent sampling to find
systematic defects, which are not normally detected by standard
automated defect inspection systems. Typical applications for
SpotCheck are reticle ID check, overlay check, die-to-die
comparison to find local process excursions, fuse inspection or
bond pad inspection.
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Flexibility and ease of operation
Successful integration of an automatic defect detection
system into a manufacturing environment relies on an
easy and fast recipe setup. The LDS3200 Windows XP®
based graphical user interface is powerful,
user-friendly and expandable. This convenient software
ensures fast setup and recipe creation. Through easy and
efficient operation it is possible to create new recipes
in a very short time. The software is capable of LAN
coupling and interfacing to all major yield management
systems. A full automation interface via SECS/GEM is
optionally available. Various image capturing and
archiving modules permit easy storage of defect images.
For review and classification it is possible to directly
link the macro results with the inline review station. A
variety of software options are available to enhance and
expand the system capabilities.
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In-line Macro ADC for real-time defect
classification
The LDS3200 is equipped with an in-line Macro ADC. This
software feature automatically classifies all detected
defects on the fly. The system is based on a defect
library with pre-defined defect classes. On demand the
user can extend the defect library with new defect
classes to adapt the ADC to process requirements. With
the defect library editor, the user can create, edit and
maintain ADC defect libraries based on defect images.
Reliability and accuracy is supported by a powerful
grouping function. Defect examples can be re-classified
by using the simple drag & drop function. Defect
libraries can be created for a specific layer. If the
layer and the type of defects are similar, it is
possible to use the defect library for several products.
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Partial Die Inspection
The LDS3200 also allows inspection of the partial dies
at the edge of the wafer. Very often, these dies are of
high interest for the current process qualification. By
just excluding these partial dies from the shotmap, the
detection system would be ”blind“ for this area. The
partial die inspection algorithm makes sure that defects
are not missed in this area.
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SAW (column) Shift algorithm
Very often, problems are clearly visible within the
scribe line but not within the cell (die). Vistec’s
unique SAW (row or column) shift algorithm enables the
scribe line to be inspected even at shifted exposure
designs. Instead of just removing the scribe lines from
the recipe (skip detection within this area), the saw
shift algorithm allows the user to focus on the scribe
lines when necessary.
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