***Semiconductor Metrology ***

Advanced Microscopy
- 3D True Color Optical Imaging
- Acoustic Microscopy
- Confocal Laser Scanning Microscopy
- Electron Microscopy
- Infrared Microscopy
- Live Cell Imaging
- Industrial Optical Microscopy
- Scanning Probe Microscopy
Focused Ion Beam (FIB)
- Single Beam System
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- Double Beam System
- Triple Beam System
- Cross Beam System
- Neon
Microanalysis
- Electron Probe Micro-Analyzer (EPMA)
- Energy Dispersive Microanalysis System (EDS)
- Wavelength Dispersive Microanalysis System (WDS)
- Electron Backscattered Diffraction (EBSD)
Surface Metrology
- 3D True Colour Optical Profiler
- Stylus Profiler
- Non-contact optical Profiler
Semiconductor Metrology
- Industrial Optical Microscopy
- Infared Microscopy
- Defect Inspection, Review and ADC
- Macro and Micro Defect Review Tool
Surface Sciences
- Sector SIMS
- Time OF Flight SIMS
- Quadrapole SIMS
- LEIS
- LEXES
- Tomographic Atom Probe
UHV Thin Film Deposition
- Physical Vapor Deposition (PVD)
- Molecular Beam Epitaxy System (MBE)
Vacuum Solution
Workstations
- Imaging Workstation
- Fluorescence Workstation
- Live Cell Imaging Workstation
- Material Workstation
Sample Preparations
- Drying
- Coating
- Cryo transfer
- Cryo-fixation
- Freeze-etch & -fracture System
- Freeze Substitution System
- Glass Knife Maker & Diamond Knives
- Ultramicrotome
- Ultramicrotome With Cryo
- Microtome
- Automatic Tissue Processor
- Argon Ion Milling System

Semiconductor Metrology
Defect Inspection, Review and ADC

Contact & Support
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Vistec INS3300

Overview
The brand new optical defect inspection and review system Vistec INS3300 is the ultimate solution for all 300mm wafer applications. A flexible system layout and the integrated software capabilities allows a perfect integration in the 300mm fab and automation processes.The ingenious handling concept in combination with the high performance of DUV optics combines highest throughput with resolution down to 80 nm, suitable for technology nodes below 01 microns.

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Key Features

High throughput of more than 200 wafers/hour
Small footprint
Flexible system layout (front-, rear- or side-loading)
Realtime tracking autofocus
Macro Inspection for front and backside
ADC in DUV mode
Complete range of imaging modes including UV and DUV
Windows NT based review and inspection software
SEMI (S2, S8, S11, E15 and etc.), CE and UL compliant
Bridge concept for 200 and 300 mm wafer
Up to 4 loadport�s (FOUP and Open Cassette)

Your Ultimate Strategic Partner