Semiconductor Metrology
Defect Inspection, Review and ADC
Contact & Support
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Vistec INS300
Overview
The Vistec INS300 is a
300mm inspection station, which is
specifically developed for the manual
visual optical inspection of wafers in
high volume IC manufacturing processes.
Based on the experience gathered with
the Vistec INS3300 within
the
last years, a cost effective inspection
station was designed to fit perfectly in
today's 300mm production facilities.
The unique features of
optics in combination with highest
throughput, automation and outstanding
cost-performance ratio makes the Vistec
INS300 to an attractive solution for
front- and backend users. Visual optical
wafer inspection will be transferred to
a new dimension.
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key Features
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300mm optical wafer inspection system
with optimal price-performance ratio
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Field proven technology guarantees
reliability and low cost of ownership
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High throughput with up to 170
wafers/hour
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Flexible system layout with small
footprint
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Superior Harmonic Component System (HCS)
optics
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Wide range of imaging modes including
brightfield (BF), darkfield (DF), differential
interference contrast (DIC) and
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ultraviolet (UV)
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Macro Inspection for front and backside
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Realtime tracking autofocus
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Easy to use through Windows XP based
application software VISCON
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SEMI (S2, S8, S11, E15 etc.), CE and UL
compliant
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SECS/GEM automation
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Detailed Description
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The Vistec INS300 is a cost-optimized 300mm wafer
inspection system. It consist of an automated Vistec microscope
with excellent optical performance and a 300mm Equipment Front
End Module (EFEM) for fully automatic and clean wafer handling.
The used technology is based on Vistec's field-proven INS3300
inspection- and review systems. The used visible control
software VISCON is easy-to-use and optimized for visual
inspection tasks.
The Vistec INS300 inspection system can be equipped with
different illumination modes to perfectly fit with the customer
requirements. Beside the standard illuminations with brightfield
(BF) and darkfield (DF) also Differential Interference Contrast
(DIC) and ultra-violet (UV) is optional available.
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The flexible system layout with 2 possible access
versions for the EFEM guarantees a small footprint and allows an
adaptation to the customer fab layout. To meet the requirements
of up-to-date high-volume fabs the handling system is designed
to reach a throughput of up to 170 wafers per hour. The wafer
front- and back-side can be inspected by using the optional
macro inspection module.
With the automation software package (SECS/GEM) it is possible
to fully automate the transport from or to the Vistec INS300
inspection stations. Recipes and inspection results can be sent
between the fab host system and the inspection system fully
automatically.
