XVision series is designed to enable demanding IC manufacturers for Ultra-high resolution 3-dimensional surface and  sub-surface process inspection and defect analysis on full 200mm or 300mm wafers at the 65/45 nanometer design node and beyond. The workstation, which in particular enables for dissection of high quality TEM lamellas from anywhere of a 200mm or 300mm wafer.

Based on an innovative high-performance automated Double Beam/Triple Beam platform, the XVision series combines the ultra-high resolution GEMINI ® SEM imaging capabilities from Carl Zeiss NTS with ultra-high precision and high current FIB cutting capabilities from SIINT. Inheriting numerous automated and user-centric functionalities for  nano-scale analysis, metrology and materials characterisation, the XVision series represents an unprecedented versatile workstation, Thus XVision series enables both, clean room process monitoring as well as wafer-level defect root cause analysis in laboratory environments.

_____________________________________________